Choose Frames or No Frames? > 자유게시판

In contrast thereto, it was confirmed that 10 Fit is assured for the present density exceeding 10.sup.6 A/cm.sup.2, within the ninth embodiment. In contrast thereto, the strategy in which the Al is crammed into the groove of the interlayer insulator realizes that the stress is dispersed as described in the sixth and eighth embodiments Consequently, there may be realized the electrode wiring structure by which the crystal grain boundaries do not occur in the bending portion or wiring connecting portion. Furthermore, by employing the electrode wiring structure based on the current invention, there is obtained the only-crystal construction suppressing the stress, so that the reliability such as the resistance of migrations can be effectively improved. Though there has been described in the sixth embodiment the electrode construction the place the barrier steel is formed only in the base face of the contact gap. FIG. 35 exhibits an electrode wiring construction in line with the eighth embodiment The electrode wiring construction shown in FIG. 34 is formed by the strategy the place the Al is crammed into the groove of the interlayer insulator with annealing as described within the sixth in addition to seventh embodiments. These electrode wiring structures are such that the Al is filled into the groove of the interlayer insulator by annealing as described in the sixth and seventh embodiments.

The wiring having the uniform crystalline orientation has excellent endurance towards electromigration and stressmigration in order to enhance the reliability of the electrode wiring. When the Al skinny movie is agglomerated on the substrate having the above wiring grooves by the use of annealing underneath a melting point thereof, Aluminum single wire the Al is crammed into the groove while the Al is almost in melting state. Namely, the liquid contacts with the solid having a contact angle of .THETA. With reference to FIG. 39A and 39B, it's most well-liked that an angle A made by the underside face and the aspect face of the groove or angles of bend B, C of the wiring are processed in a fashion that those angles are equal to the angles of crystal side. In comparison with a projection type construction which is etching-processed, within the groove sort construction the place the wiring steel is stuffed into the groove of the interlayer insulator, the wiring steel is already lined with each the bottom face and aspect face of the groove, in order that the stress generated at a later stage of thermal processing can be scattered into three faces and there doesn't remain the mechanical stress contained in the wiring.

It rotates its legs when on it is facet to elevate them horizontaly and then rotates them forward. The Maxon motors have been too weak to elevate the robotic sufficiently. I was originaly doing a 2 motor walker, however I realized the MECI motors couldn't carry a walker, so I added 2 more, one for every leg, however my mistake was that now it had virtually 2x the burden and one motor is still all that lifts. The circuit board actualy turns into the frame for the motors and the legs! This robot is a very high quality design, and it was kinda unhappy to remove and change the motors, trigger the bot was named for the motors source (MECI). I just can't throw away a robotic I've spent nearly 24 total hours on, even if I can save $40 on servos. Moreover, if the native oxide film is suppressed from being formed on the wiring metal surface, the floor atoms will probably be further straightforward to maneuver, will have a tendency to achieve the melting state at an additional decrease temperature, and can prevent impurities resembling oxygen which disturbs the crystal orientation from mixing thereinto.

Next, with reference to FIG. 28D, there may be formed a SiO.sub.2 film 38 serving as the interlayer insulator, by a plasma CVD technique. On the surface of the SiO.sub.2 movie 38, there is formed a groove 39 serving as a second layer Al wiring where the width and depth thereof are 1.2 .mu.m and 0.Eight .mu.m, respectively, by the photo-lithography and RIE. With reference to FIG. 28E, the second layer Al wiring forty one was formed beneath the same condition during which the first layer Al wiring 37 was formed. When a plurality of grooves thus formed are usually not linked in the identical layer, particularly, when the Al wirings aren't related in the same layer as in pattern A, pattern B and pattern C proven in FIG. 35, it was confirmed by the TEM analysis that each pattern shows totally different crystalline orientation. It is to be famous that the C movie used because the stopper layer could be eliminated with ease by subjecting it to the O.sub.2 plasma. Therefore, the atoms at the surface or grain boundary of the movie can be simply diffused with a small quantity of power. After the polishing was accomplished on the stopper layer, a small quantity of residual Al was eliminated by a wet etching.